发明名称 発光装置
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device having high reliability that suppresses decrease in light extraction efficiency by using a material excellent in heat resistance, light-fastness, etc. <P>SOLUTION: A light emitting device has a substrate 12, a metal member 11 that is formed on the substrate 12 and has a silver-contained layer disposed on the surface thereof, plural semiconductor light emitting elements 13 mounted on the metal member 11, plural first holes 15 formed in the metal member 11 so as to surround the semiconductor light emitting elements 13, and a translucent member 14 which continuously covers the surface of the metal member 11 and the first holes 15. Each first hole 15 is formed at the center of at least one of intervals having the maximum distance between one semiconductor light emitting element 13 and each of plural light emitting elements 13 adjacent to the one semiconductor light emitting element 13. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5781741(B2) 申请公布日期 2015.09.24
申请号 JP20100094556 申请日期 2010.04.16
申请人 日亜化学工業株式会社 发明人 笹野 玄明
分类号 H01L33/60 主分类号 H01L33/60
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