| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve stabilized bonding in a short time, in the mounting of an electronic component.SOLUTION: The metal electrode of a substrate is coated with a metal fine powder paste, produced by mixing fine powder of a first metal and fine powder of one kind or more of second metal having a higher melting point. The metal electrode of an electronic component is arranged on the metal fine powder paste thus applied, and the metal fine powder paste is warmed thus volatilizing the solvent. Thereafter, the electronic component is compressed in the direction for pressing to the substrate side, and heated quickly at a predetermined temperature rise rate, until reaching a temperature equal to or higher than the melting point of the first metal, thus bonding the metal electrode of the substrate and the metal electrode of an electronic component.</p> |
