发明名称 PACKING MATERIAL FOR MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a packing material for molding without separating when a colored layer is partially cracked, even when used under a slightly severe environment such as the high temperature-high humidity, in molding time and sealing time.SOLUTION: A packing material 1 for molding is provided by laminating a heat-resistant resin layer 2, a first adhesive layer 5, a metal foil layer 4, a second adhesive layer 6 and a thermoplastic resin layer 3 on the inside from the outside, and the first adhesive layer 5 is composed of a coloring adhesive composition including a coloring pigment and an adhesive including a two-liquid curable polyester urethane resin of a polyester resin as a main agent and a multifunctional isocyanate compound as a hardening agent, and the polyester resin is 8,000-25,000 in number average molecular weight (Mn), and is 15,000-50,000 in weight average molecular weight (Mw), and these ratio (Mw/Mn) is 1.3-2.5, and the multifunctional isocyanate compound includes aromatic isocyanate of 50 mol% or more.</p>
申请公布号 JP2015166261(A) 申请公布日期 2015.09.24
申请号 JP20140071368 申请日期 2014.03.31
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 TAKADA SUSUMU;NANBORI YUJI
分类号 B65D65/40;B32B15/09;B32B27/00;B32B27/36;B65D1/00;B65D1/28;H01M2/02 主分类号 B65D65/40
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