发明名称 |
PRESSURE SENSOR, MICROPHONE, AND ACOUSTIC PROCESSING SYSTEM |
摘要 |
According to one embodiment, a pressure sensor includes: a base body; a sensor section; and a processing circuit. The sensor section includes: a transducing thin film; a first strain sensing element; and a second strain sensing element. The transducing thin film has a film surface and is flexible. The processing circuit is configured to output as an output signal at least one of a first signal obtained from the first strain sensing element upon application of external pressure to the transducing thin film and a second signal obtained from the second strain sensing element upon application of the external pressure to the transducing thin film. |
申请公布号 |
US2015271586(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201414584476 |
申请日期 |
2014.12.29 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
FUKUZAWA Hideaki;SAKURAI Masatoshi;KII Masayuki;FUJI Yoshihiko;HARA Michiko;HIGASHI Yoshihiro;OTSU Kenji;YUZAWA Akiko;OKAMOTO Kazuaki |
分类号 |
H04R1/08;G01L9/00 |
主分类号 |
H04R1/08 |
代理机构 |
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代理人 |
|
主权项 |
1. A pressure sensor comprising:
a base body; a sensor section provided on the base body; and a processing circuit configured to process a signal obtained from the sensor section, the sensor section including:
a flexible transducing thin film having a film surface;a first strain sensing element provided on the film surface at a position being different from barycenter of the film surface; anda second strain sensing element provided on the film surface at a position spaced from the first strain sensing element and being different from the barycenter, and the processing circuit being configured to output as an output signal at least one of a first signal obtained from the first strain sensing element upon application of external pressure to the transducing thin film and a second signal obtained from the second strain sensing element upon application of the external pressure to the transducing thin film. |
地址 |
Minato-ku JP |