| 摘要 |
A semiconductor light-emitting device having favorable optical characteristics can include a first conductor pattern having a die-bonding pad and a second conductor pattern having a wire bonding pad, which are formed on a circuit board. The semiconductor light-emitting device can also include a semiconductor light-emitting chip mounted on the die-bonding pad, a first encapsulating material, which can include a wavelength converting material to wavelength-convert light emitted from the chip and can cover the chip in a substantially fair dome shape on the circuit board, and a second encapsulating resin to cover the first encapsulating material, which can transmit light emitted from the first encapsulating material. Thus, the disclosed subject matter can provide the semiconductor light-emitting device, which can emit a mixture light having various color tones and the favorable optical characteristics and which can be used to illuminate goods laid out in a narrow show window, a vending machine, etc. |
| 主权项 |
1. A semiconductor light-emitting device including an optical axis comprising:
a circuit board having a top surface, a bottom surface, a first side surface and a second side surface located between the top surface and the bottom surface, and being formed in a substantially rectangular tabular shape, the first side surface and the second side surface located in an opposite direction with respect to each other; a first conductor pattern including a first external electrode and a die-bonding portion, the first external electrode extending from the top surface of the circuit board toward the bottom surface of the circuit board along a longitudinal direction of the circuit board via the first side surface of the circuit board, and the die-bonding portion having a die-bonding pad, at least one die-bonding first wire bonding pad and a connecting pattern extending from the first external electrode toward a middle portion on the top surface of the circuit board along the longitudinal direction of the circuit board, the connecting pattern being electrically connected between the die-bonding pad and the first external electrode, the die-bonding pad having a central point and a plurality of apical ends formed in a substantially circular shape, the plurality of apical ends located on an outer circumference of the circular shape, and the at least one die-bonding first wire bonding pad projecting from the outer circumference of the die-bonding pad in an outward direction of the die-bonding pad, wherein a respective one of the apical ends of the die-bonding pad is located in each of middle portions of circular connecting portions between the die-bonding pad and the connecting pattern and between the die-bonding pad and the at least one die-bonding first wire bonding pad; a second conductor pattern including an second external electrode and a second wire bonding pad, the second external electrode extending from the top surface of the circuit board toward the bottom surface of the circuit board along the longitudinal direction of the circuit board via the second side surface of the circuit board, the second wire bonding pad projecting from the second external electrode toward the first conductor pattern along the longitudinal direction on the top surface of the circuit board; a semiconductor light-emitting chip having a top surface, a bottom surface, a first electrode and a second electrode mounted on the die-bonding pad of the die-bonding portion of the first conductor pattern, the top surface of the semiconductor light-emitting chip having a substantially center formed in either a substantially square shape or a substantially rectangular shape, the center of the top surface of the semiconductor light-emitting chip being located over the central point of the die-bonding pad of the first conductor pattern, the first electrode of the semiconductor light-emitting chip formed either on the top surface of the chip or underneath the bottom surface of the chip, the second electrode of the semiconductor light-emitting chip formed on the top surface of the semiconductor light-emitting chip and being electrically connected to the second wire bonding pad of the second conductor pattern via a second bonding wire; a first encapsulating material encapsulating the semiconductor light-emitting chip and a part of the second bonding wire in a dome shape on the top surface of the circuit board; a second encapsulating resin covering at least the first encapsulating material and another part of the second bonding wire exposed from the first encapsulating material; and wherein each of angles between the adjacent imaginary lines connecting the central point of the die-bonding pad to the plurality of apical ends of the die-bonding pad is configured to become a substantially same angle. |
