CHIP PACKAGE AND METHOD THEREOF

摘要

The present invention provides a chip package that includes a semiconductor chip, at least one recess, a plurality of first redistribution metal lines, and at least one protrusion. The semiconductor chip has a plurality of conductive pads disposed on an upper surface of the semiconductor chip. The recess extends from the upper surface to a lower surface of the semiconductor chip, and is arranged on the side of the semiconductor chip. The first redistribution metal lines are disposed on the upper surface, electrically connected to the conductive pad individually, and extended into the recesses separately. The protrusion is disposed in the recess and located between the adjacent first redistribution metal lines.

主权项

1. A chip package, comprising:
a semiconductor chip having a plurality of conductive pads disposed on an upper surface of the semiconductor chip; at least one recess extended from the upper surface to a lower surface of the semiconductor chip, and arranged on a side of the semiconductor chip; a plurality of first redistribution metal lines disposed on the upper surface, electrically connected to the conductive pads individually, and extended into the recess separately; and at least one protrusion disposed in the recess and located between the adjacent first redistribution metal lines.