| 摘要 |
Provided is a photosensitive composition for volume hologram recording layer formation. The photosensitive composition gives a volume hologram recording layer that has excellent moisture resistance and thermal stability, less undergoes cure shrinkage upon hologram recording, and offers excellent multiple recording properties.;The photosensitive composition for volume hologram recording layer formation includes components (A), (B), (C), (D), and (E). Component (A) is at least one cationically polymerizable compound including a compound represented by Formula (1). Component (B) is a compound containing an active-proton-containing functional group. Component (C) is a thermal acid generator. Component (D) is a radically polymerizable compound. Component (E) is a radical-polymerization initiator. Components (A), (B), and (C) constitute a precursor material for three-dimensional cross-linked polymer matrix. Components (A), (B), and (C) are present in the precursor material for three-dimensional cross-linked polymer matrix in such proportions that the molar ratio of the active-proton-containing functional group of Component (B) to cycloaliphatic epoxy groups of the compound represented by Formula (1) in Component (A) is from 0.01 to 0.3. Formula (1) is expressed as follows:; |
| 主权项 |
1. A photosensitive composition for volume hologram recording layer formation, the photosensitive composition comprising following components:
(A) at least one cationically polymerizable compound comprising a compound represented by Formula (1); (B) a compound comprising an active-proton-containing functional group; (C) a thermal acid generator; (D) a radically polymerizable compound; and (E) a radical-polymerization initiator, Components (A), (B), and (C) constituting a precursor material for three-dimensional cross-linked polymer matrix, Components (A), (B), and (C) being present in the precursor material for three-dimensional cross-linked polymer matrix in such proportions that a molar ratio of the active-proton-containing functional group of Component (B) to cycloaliphatic epoxy groups of the compound represented by Foimula (1) in Component (A) is from 0.01 to 0.3, Formula (1) being expressed as follows:wherein n represents an integer from 0 to 10; X represents, independently in each occurrence, one divalent group selected from the group consisting of oxygen, —CH2—, —C(CH3)2—, —CBr2—, —C(CBr3)2—, —CF2—, —C(CF3)2—, —CCl2—, —C(CCl3)2—, and —CH(C6H5)—, where, when n is 2 or more, two or more occurrences of X may be identical or different; R1 to R18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally comprising oxygen or halogen, and optionally substituted alkoxy. |
