摘要 |
<p>A method of manufacturing a hearing device (100), the method comprising the steps of molding a substrate for obtaining a first and a second half-shell (1, 2), creating an electrical interconnection layout (3) on an inner concave surface of at least one of the first half-shell (1) and the second half-shell (2) by using Molding Interconnect Device technology, the electrical interconnection layout (3) being adapted to receive electronic components (4, 5, 6), positioning the electronic components (4, 5, 6) within at least one of the first and the second half-shell (1, 2), electrically connecting contacts of the electronic components (4, 5, 6) with corresponding contacts of the electrical interconnection layout (3), and joining the first and the second half-shell (1, 2) for at least partly forming a housing of the hearing device (100).</p> |
申请人 |
SONOVA AG |
发明人 |
KARAMUK, ERDAL;MÜLLER, MARKUS;MATHEY, MICHAEL;VUILLE-DIT-BILLE, KATHRIN;ZINK, CHRISTIAN;FUCHS, SVEN;DIETRICH, KATJA |