发明名称 WIRE SAW
摘要 <p>PROBLEM TO BE SOLVED: To provide a wire saw which uses a photocurable resin for the adhesion of an abrasive grain and has excellent cutting workability and durability.SOLUTION: This invention provides a wire saw 1 having a wire 10, a resin layer 20 provided on the outer peripheral face of the wire 10, and an abrasive grain 30 disposed on the resin layer 20. The resin layer 20 includes a photocurable resin 22 and a filler 24. The filler 24 is coupled to the photocurable resin 22 through a coupling agent.</p>
申请公布号 JP2015166125(A) 申请公布日期 2015.09.24
申请号 JP20140041627 申请日期 2014.03.04
申请人 NORITAKE CO LTD 发明人 INUKAI HIROYUKI
分类号 B24D11/00;B23D61/18;B24D3/00;B24D3/02;B24D3/28;B28D1/22;B28D5/04 主分类号 B24D11/00
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