POWER AMPLIFICATION CIRCUIT AND TRANSMITTER

摘要

A power amplification circuit capable of improving low-frequency resonance frequency and having a more flexible design; the power amplification circuit comprises a power amplification die, a first metal oxide semiconductor capacitor (Moscap1), a direct current decoupling capacitor (CLF) and an output matching network; the drain electrode of the power amplification die is connected to the first end of the first metal oxide semiconductor capacitor (Moscap1) via a bonding wire (LB1); the second end of the first metal oxide semiconductor capacitor (Moscap1) is grounded; the drain electrode of the power amplification die is directly connected to the output matching network via a bonding wire (LB2); the source electrode of the power amplification die is grounded; the first end of the first metal oxide semiconductor capacitor (Moscap1) is connected to one end of the direct current decoupling capacitor (CLF) via a bonding wire (LB3); and the other end of the direct current decoupling capacitor (CLF) is grounded.