| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of capturing cations entering from the outside in a production process of a semiconductor device and preventing reduction in electric characteristics of the semiconductor device to be produced to improve product reliability.SOLUTION: The adhesive sheet includes components (a)-(c): (a) an acrylic resin with the weight average molecular weight of 800,000 or higher; (b) at least one of an epoxy resin and a phenol resin; and (c) a complexing agent forming a complex with metallic ion. The adhesive sheet is composed of organic components alone. |
