发明名称 ヒートシンクを含む冷却構造部を備えるサーボアンプ
摘要 <p>A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.</p>
申请公布号 JP5785203(B2) 申请公布日期 2015.09.24
申请号 JP20130035565 申请日期 2013.02.26
申请人 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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