发明名称 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 A chemically amplified positive-type photosensitive resin composition capable of suppressing the phenomenon of footing in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition. A mercapto compound is contained in the composition which includes an acid generator capable of producing an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.
申请公布号 US2015268553(A1) 申请公布日期 2015.09.24
申请号 US201514662659 申请日期 2015.03.19
申请人 Tokyo Ohka Kogyo Co., Ltd. 发明人 Katayama Shota;Washio Yasushi;Shimizu Takahiro
分类号 G03F7/004;G03F7/20 主分类号 G03F7/004
代理机构 代理人
主权项 1. A chemically amplified positive-type photosensitive resin composition comprising: (A) an acid generator that produces an acid upon irradiation with an active ray or radiation; (B) a resin whose solubility in alkali increases under the action of acid; and (C) a mercapto compound represented by the formula (1): wherein R1 and R2 each independently represents a hydrogen atom or an alkyl group; R3 represents a single bond or an alkylene group; R4 represents an aliphatic group with a valency of u optionally containing an atom other than a carbon atom; and u represents an integer of 2 to 4.
地址 Kawasaki-shi JP