ANODE CONNECTION STRUCTURE OF ORGANIC LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF

摘要

A method is provided for manufacturing an anode connection structure of an organic light-emitting diode. The anode connection structure includes: a thin-film transistor and an anode of an organic light-emitting diode arrange don the thin-film transistor. The thin-film transistor includes a low-temperature poly-silicon layer formed on a substrate, a gate insulation layer formed on the low-temperature poly-silicon layer, a gate formed on the gate insulation layer, a protection layer formed on the gate, and a source/drain formed on the protection layer. The method includes a step of forming a hole in the thin-film transistor to expose the low-temperature poly-silicon layer and a step of forming an electrically conductive layer in the hole for direct engagement with the low-temperature poly-silicon layer to serve as an anode and also the source/drain of the thin-film transistor. The anode of the organic light-emitting diode is thus directly connected to the low-temperature poly-silicon layer.

主权项

1. A method for manufacturing an anode connection structure of an organic light-emitting diode, comprising the following steps:
providing a substrate, wherein the substrate comprises a thin-film transistor formed thereon; forming a planarization layer on the thin-film transistor; forming a hole in the planarization layer and the thin-film transistor to expose the low-temperature poly-silicon layer of the thin-film transistor; and forming an electrically conductive layer on the planarization layer and the exposed low-temperature poly-silicon layer to be in direct contact engagement with the low-temperature poly-silicon layer and patternizing the electrically conductive layer to form a new source/drain on the low-temperature poly-silicon layer and also forming an anode of an organic light-emitting diode on the planarization layer, the anode of the organic light-emitting diode being connected to the new source/drain and in direct contact engagement with the low temperature poly-silicon layer.