Semiconductor Device Package and Method of the Same

摘要

The invention proposes a semiconductor device package structure, comprising a substrate, an adhesive layer and a die. The substrate has electrical through-holes to inter-connect a first and second wiring circuit on a top surface and a bottom surface of the substrate respectively, wherein a contact conductive bump is formed on the first wiring circuit. The under-fill adhesive layer is formed on the top surface and the first wiring circuit of the substrate except the area of the die. The die has a bump structure on the bonding pads of the die, wherein the bump structure of the die is electrically connected to the contact conductive bump of the first wiring circuit of the substrate.

主权项

1. A semiconductor device package, comprising:
a substrate with electrical through-holes to inter-connect a first wiring circuit on a top surface of said substrate and a second wiring circuit on a bottom surface of said substrate, wherein a contact conductive bump is formed on said first wiring circuit; an adhesive layer on said top surface and said first wiring circuit of said substrate; and a die with a bump structure on the bonding pads of said die, wherein said bump structure of said die is electrically connected to said contact conductive bump of said first wiring circuit of said substrate.