| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring structural body having high resistance to a heat treatment step.SOLUTION: A multilayer wiring structural body includes a multilayer wiring structure in which a first wiring layer, a second wiring layer, and a third wiring layer are laminated on a substrate in this order from the substrate side. The multilayer wiring structure includes a first via connecting the first wiring layer and the second wiring layer, and a second via connecting the second wiring layer and the third wiring layer. The multilayer wiring structural body separates the multilayer wiring structure from the substrate, and includes an insulating intermediate layer having a lower Young's modulus than the substrate. The first via and the second via are superimposed with each other in a plan view. The multilayer wiring structural body further includes a first inorganic insulating layer, a second inorganic insulating layer, and a first organic insulating layer on the first wiring layer.</p> |
