| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for efficiently producing a readily peelable polyamide-imide film having excellent heat resistance, surface smoothness, and transparency in good yield because more excellent heat resistance, surface smoothness, and transparency are required for a film used in electric and electronic members, optodevice members, etc., according to development of miniaturizing and weight saving and higher functionality of electronic information equipment etc. <P>SOLUTION: There is provided the method for producing the polyamide-imide film including (1) a step of applying a polyamide-imide resin onto a polyimide film containing p-phenylenediamine as a diamine component at a concentration exceeding 20 mol%, and carrying out drying and film formation; and (2) a step of peeling a film formed from a solution of the polyamide-imide resin from the polyimide film. The arithmetic average surface roughness (Ra) of the polyamide-imide film is≤0.5μm. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
