| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a hollow package having high airtightness. <P>SOLUTION: A hollow package (1) includes: a first substrate (10); a second substrate (18); spacers (12), each of which is formed between the first substrate and the second substrate and formed by a resin having both end surfaces closely contacting with the first substrate and the second substrate; and metal films (14, 16) continuing into and closely contacting with a side wall surface of each spacer, the first substrate, and the second substrate. Parts of the metal films get into an area between the second substrate and each spacer. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
