发明名称 |
THERMAL STAND-OFF WITH TORTUOUS SOLID-WALL THERMAL CONDUCTION PATH |
摘要 |
A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section. |
申请公布号 |
US2015271955(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201414219041 |
申请日期 |
2014.03.19 |
申请人 |
Aerojet Rocketdyne, Inc. |
发明人 |
Noonan Kevin Mark |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A thermal stand-off comprising:
a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location, the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location, the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region. |
地址 |
Sacramento CA US |