发明名称 THERMAL STAND-OFF WITH TORTUOUS SOLID-WALL THERMAL CONDUCTION PATH
摘要 A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.
申请公布号 US2015271955(A1) 申请公布日期 2015.09.24
申请号 US201414219041 申请日期 2014.03.19
申请人 Aerojet Rocketdyne, Inc. 发明人 Noonan Kevin Mark
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A thermal stand-off comprising: a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location, the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location, the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region.
地址 Sacramento CA US