WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE, AND MULTILAYER CIRCUIT BOARD

摘要

A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

主权项

1. A wiring method for mutually connecting by wiring a plurality of parts to be connected which are exposed on a surface of a structure, wherein the method comprising:
an insulating layer forming step of forming an insulating layer on a surface of the structure where the plurality of parts to be connected are exposed; and a wiring forming step of providing wiring having a main body section which is positioned on a surface of the insulating layer and a branch section which branches from the main body section, extends inside the insulating layer, and reaches a part to be connected of a connection object.