| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Provided is a semiconductor device using a lead frame, in which an outer lead (5) is electrically connected to an inner lead suspension lead (3) via an inner lead, and hence a plated film is also formed on an outer lead cut surface (11) so that a solder layer is easily formed on all of surfaces of the outer lead extending from an encapsulating resin (10). Further, the inner lead suspension lead (3) includes a first narrowed portion (12a), which can suppress impact to be generated when the inner lead suspension lead is cut. |
| 申请公布号 |
US2015270197(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514644249 |
申请日期 |
2015.03.11 |
| 申请人 |
SEIKO INSTRUMENTS INC. |
发明人 |
TAGUCHI Yasuhiro |
| 分类号 |
H01L23/495;H01L21/66;H01L21/56;H01L23/31;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
an encapsulating resin for covering a semiconductor chip mounted on an island of a lead frame; an outer lead extending from a side surface of the encapsulating resin; an inner lead connected to the outer lead; an inner lead suspension lead connected to the inner lead, and extending from the encapsulating resin; and a plated film formed on all of surfaces of the outer lead, the inner lead suspension lead having a first narrowed portion, and the first narrowed portion overlapping with an outline of the encapsulating resin in plan view. |
| 地址 |
Chiba-shi JP |
