SUBSTRATE DICING DEVICE AND SUBSTRATE DICING METHOD

摘要

The present specification discloses a substrate cutting device and a substrate cutting method to process a glass substrate block by cutting a glass substrate. The substrate cutting method includes: processing the edge of the glass substrate block on the glass substrate; and simultaneously processing a plurality of glass substrate blocks by processing a linear part of one glass substrate block and a linear part of another glass substrate block at the same time, wherein the linear parts are placed on the same line.