发明名称 IMPLANTABLE MEDICAL DEVICE HEADER
摘要 Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
申请公布号 EP2919855(A1) 申请公布日期 2015.09.23
申请号 EP20130786576 申请日期 2013.10.22
申请人 MEDTRONIC INC. 发明人 BATES, DAVID;HAENISCH, CHRISTOPHER M.;OLSON, JOHN C.;PATRAS, GEORGE;PRASANNAKUMAR, JEEVAN M.;WEIAND, JASON P.;ZHAO, YANZHU
分类号 A61N1/375;A61N1/372;B29C45/16;B29L31/00;H01Q1/27;H01Q9/42;H05K7/02;H05K13/00 主分类号 A61N1/375
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