APPARATUS AND METHOD TREATING SUBSTRATE

摘要

The present invention provides an apparatus and a method for treating a substrate by using process gas. The apparatus for treating a substrate includes a chamber which provides a process space for performing the substrate, and a detection unit which detects the amount of reaction byproducts attached to the inner wall of the chamber. The detection unit includes a window member which is provided to the inner wall of the chamber, and an optical member which emits and receives light through the window member. The window member is installed on the inner wall of the chamber. The internal state of the chamber is measured by emitting and receiving light through the window member. Therefore, the inner wall condition of the chamber can be more accurately measured.