| 摘要 |
<p>A backplane configured to receive electrical components is provided. The backplane in one example includes a substrate comprising an at least partially flexible material, a plurality of backplane traces formed as part of the substrate, at least one connector island formed in the substrate, with the at least one connector island located in an opening in the substrate and configured to receive at least one mating electrical component, and one or more spring elements bridging between the at least one connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the at least one connector island and with the one or more spring elements allowing the at least one connector island to flex with respect to the substrate and absorb vibrations.</p> |
