发明名称 |
Au BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
A semiconductor device according to the present invention, having an Au-based solder layer (3) sandwiched between a semiconductor element (1) and a Cu substrate (2) made mainly of Cu, in which the semiconductor device includes: a dense metal film (23) which is arranged between the Cu substrate (2) and the Au-based solder layer (3), and has fine slits (24) patterned to have a predetermined shape in a plan view; and fine structures (4) with dumbbell-like cross section, which have Cu and Au as main elements, and are each buried in the Cu substrate (2), the Au-based solder layer (3), and the fine slits (24) of the dense metal film (23). |
申请公布号 |
EP2922087(A1) |
申请公布日期 |
2015.09.23 |
申请号 |
EP20130855530 |
申请日期 |
2013.11.13 |
申请人 |
NISSAN MOTOR CO., LTD;SANKEN ELECTRIC CO., LTD.;FUJI ELECTRIC CO., LTD. |
发明人 |
TANIMOTO, SATOSHI;SATO, SHINJI;TANISAWA, HIDEKAZU;MATSUI, KOHEI |
分类号 |
H01L23/373;H01L21/60;H01L23/488;H01L23/495 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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