| 摘要 |
One embodiment of the present invention relates to a system and a method for localized high density substrate routing. According to one or more embodiments, an apparatus includes a medium, first and second circuit elements, an interconnect element, and a dielectric layer. The medium can include low density routing inside. The interconnect element can be buried in the medium and include a plurality of electrically conductive members inside. The electrically conductive members can be electrically connected to the first and second circuit elements. The interconnect element can include high density routing inside. The dielectric layer can be mounted on an interconnect die and include the first and second circuit elements penetrating the dielectric layer. |
