| 摘要 |
The present invention provides a semiconductor device. The semiconductor device has high reliability to be mounted. A quad flat package (QFP) comprises: a die pad (1c) where a semiconductor chip (2) is mounted; a plurality of inner parts (1a) arranged on the periphery of the die pad (1c); a plurality of outer parts (1b) connected with the inner parts (1a), respectively; a plurality of wires (4) electrically connecting a bonding pad (2c) of the semiconductor chip (2) with each of the inner parts (1a); and a sealing body (3) sealing the semiconductor chip (2). Also, the thickness (T1) of the semiconductor chip (2) is bigger than the thickness (T5) from the lower surface (1cb) of the die pad (1c) to the lower surface (3b) of the sealing body (3). In addition, distance (D1) from the lower surface (3b) of the sealing body (3) to each front end (1be) of the outer parts (1b) is larger than the thickness (T4) from the main surface (2a) of the semiconductor chip (2) to the front surface (3a) of the sealing body (3). |
