LED PACKAGE

摘要

Described are an LED package and a manufacturing method thereof. The LED package includes a package substrate, a first LED chip which is mounted on the package substrate, a first fluorescent layer which is arranged on the first LED chip, a reflection layer which surrounds the sides of the first fluorescent layer and the first LED chip, and a mask which is arranged on the reflection layer and includes a first opening part to expose the surface of the first fluorescent layer.