| 摘要 |
<p>An embodiment provides power (having low voltage, high current, and high current density) to ultra low voltage non-CMOS based devices using a distributed capacitor that is integrated onto the same chip as the non-CMOS devices. For example, an embodiment provides a spin logic gate adjacent dielectric material and first and second plates of a capacitor. The capacitor discharges low voltage/high current to the spin logic gate using a step down switched mode power supply that charges numerous capacitors during one clock cycle (using a switching element configured in a first orientation) and discharges power from the capacitors during the opposite clock cycle (using the switching element configured in a second orientation). The capacitors discharge the current out of plane and to the spin logic devices without having to traverse long power dissipating interconnect paths. Other embodiments are described herein.</p> |
