| 发明名称 |
SUBSTRATE DICING DEVICE AND SUBSTRATE DICING METHOD |
| 摘要 |
<p>Disclosed in the present invention are a substrate dicing device preheating a surface of a glass substrate including a reinforcing layer, and cutting the preheat glass substrate to prevent formation of a fine crack or a particle on a cut surface of the cut glass substrate block; and a substrate dicing method.</p> |
| 申请公布号 |
KR20150107204(A) |
申请公布日期 |
2015.09.23 |
| 申请号 |
KR20140029743 |
申请日期 |
2014.03.13 |
| 申请人 |
ZEUS CO., LTD. |
发明人 |
LEE, KYUNG JU;YANG, JEONG SOON;PARK, YOUNG IK;JUNG, KWANG IL;KI, BEOM SU |
| 分类号 |
C03B33/09;C03B33/02 |
主分类号 |
C03B33/09 |
| 代理机构 |
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代理人 |
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