Integrated circuit including alignment mark and display device including said integrated circuit

摘要

An integrated circuit (100) that includes a substrate (10), a semiconductor layer arranged on the substrate and an insulating layer (50) arranged on an upper portion of the semiconductor layer and including a bump (51) provided on an upper surface thereof, wherein the semiconductor layer includes a main semiconductor area (32) and an alignment mark area (31) including a p-type semiconductor and including an internal alignment mark that is overlapped by a metallic external alignment mark (52a) arranged on the upper surface of the insulating layer (50). The p-type semiconductor internal alignment mark can be viewed by an infrared camera during a mounting process of the integrated circuit.