BOARD TRANSFER STAGE AND CUTTING METHOD OF BOARD USING IT

摘要

The present invention relates to a substrate transfer stage for quickly transferring a cut substrate to following processes. The substrate transfer stage comprises: a housing with a plurality of suctioning holes for suctioning a substrate, wherein the housing has a predetermined internal space and one plate surface of the substrate is to be cut; a plurality of vacuum space units in which the internal space is partitioned by a plurality of partition walls formed in the housing; and a vacuum forming unit which enables a substrate to be suctioned to the suctioning hole by selectively making the vacuum space units in a vacuum state, wherein the substrate is to be cut. A substrate is tightly fixed when the substrate is cut, so the substrate is stably cut. Only a scrap is separately separated after the substrate is cut, so the cut substrate is transferred to following processes in batches.