发明名称 Electronic device, method for manufacturing thereof, and electronic apparatus
摘要 An electronic device includes: a first member having a first surface; a second member placed on the side of the first surface; a functional element accommodated in a cavity formed by the first member and the second member; an external connection terminal disposed outside of the cavity on the side of the first surface of the first member; a groove portion disposed on the side of the first surface of the first member and extending from the inside to the outside of the cavity; a wiring disposed within the groove portion and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove portion in plan view; and a filling member disposed within the first through-hole and filling the groove portion.
申请公布号 US9144159(B2) 申请公布日期 2015.09.22
申请号 US201313760626 申请日期 2013.02.06
申请人 Seiko Epson Corporation 发明人 Takagi Shigekazu
分类号 H05K5/02;H05K13/00;B81B7/00;H05K1/18 主分类号 H05K5/02
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. An electronic device comprising: a first member having a first surface; a second member placed on the first surface of the first member; a cavity formed between the first and second members; a functional element accommodated in the cavity; an external connection terminal disposed outside of the cavity on the first surface of the first member; a groove formed in the first surface of the first member, the groove extending from inside of the cavity to the external connection terminal; a wiring disposed within the groove and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove in a plan view; and a filling member disposed within the first through-hole, wherein a depth of the groove is larger than a thickness of the wiring so that an aft gap is provided between the second member and a top surface of the wiring, and the filling member is formed in the air gap of the groove below the second member so that no air communication is permitted between the inside of the cavity and the external connection terminal via the groove.
地址 JP