Manufacturing method of printed wiring board and printed wiring board

摘要

Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method. To achieve the object, a method for forming the wiring pattern adopted includes steps; for forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 μm or less and thickness of 5 μm or less is laminated to a conductive layer via an insulating layer; for providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; for filling-up the blind-hole by a electro-plated copper in the time for depositing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 15 μm or less, for providing of an etching resist layer having thickness of 15 μm or less and for etching of the copper layer.

主权项

1. A manufacturing method of a printed wiring board comprising:
forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 μm or less and thickness of 5 μm or less is laminated to a conductive layer via an insulating layer; providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; providing an electroless-plated copper layer on a surface of the copper foil layer and an inner wall of the blind-hole; providing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 10 μm or less, and filling-up the blind-hole to a level substantially even with a surface of the electro-plated copper layer by an electro-plated copper; providing an etching resist layer having thickness of 15 μm or less on a surface of the electro-plated copper layer; and etching the copper layer not covered with the etching resist layer to form a wiring pattern.