Light-emitting diodes on a wafer-level package

摘要

A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.

主权项

1. A light emitter, comprising:
a first light source having a first contact pad and a second contact pad and an active area configured to emit light of a first predetermined wavelength when an electrical potential is applied across the first contact pad of the first light source and the second contact pad of the first light source; a second light source having a first contact pad and a second contact pad and an active area configured to emit light of a second predetermined wavelength when an electrical potential is applied across the first contact pad of the second light source and the second contact pad of the second light source; and a jumper chip comprising a first bonding area and a second bonding area that is electrically isolated from the first bonding area, wherein the first bonding area and second bonding area are created by a plurality of isolated conductive vias extending through a body of the jumper chip, wherein the first contact pad of the first light source is connected to the first bonding area of the jumper chip with a first electrical contact, wherein the first contact pad of the second light source is connected to the second bonding area of the jumper chip with a second electrical contact, and wherein the first and second electrical contacts correspond to the only connections between the first and second light sources and the jumper chip.