LED (light-emitting diode) encapsulation and manufacturing method thereof

摘要

The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and the quantum dot rail (40). The first frame (10) includes a PCB (12) and four sidewalls (14). The four sidewalls (14) surround and circumferentially delimit an accommodation space (18). The plurality of LED elements (20) is mounted on the PCB (12) and in electrical connection therewith. The encapsulant (30) is filled in the accommodation space (18). The four sidewalls (14) each have a top end portion forming a mounting section (16). The quantum dot rail (40) is mounted in the mounting sections (16) so that the quantum dot rail (40) is located above the encapsulant (30). The first frame (10), the plurality of LED elements (20), and the quantum dot rail (40) are collectively and integrally encapsulated so as to be fixedly assembled together.

主权项

1. An LED (Light-Emitting Diode) encapsulation, comprising: a first frame, a plurality of LED elements, encapsulant, and a quantum dot rail, the first frame comprising a PCB (Printed Circuit Board) and four sidewalls respectively formed on four peripheral edges of the PCB, the four sidewalls surrounding and circumferentially delimiting an accommodation space, the plurality of LED elements being mounted on the PCB and located in the accommodation space and in electrically connection with the PCB, the encapsulant being filled in the accommodation space, the four sidewalls each having a top end portion that forms a mounting section, the quantum dot rail being mounted in the mounting sections in such a way that the quantum dot rail is located above the encapsulant, the first frame, the plurality of LED elements, and the quantum dot rail being collectively and integrally encapsulated to be fixedly assembled together.