| 摘要 |
An apparatus for testing a package-on-package semiconductor device includes an uppermost cover, a lower base, a heat dissipation module, and probes. The lower base is arranged under the uppermost cover to form an internal receiving space for receiving an upper chip. The heat dissipation module is arranged in the internal receiving space and includes a heat sink attached to the upper surface of the upper chip. The probes are arranged in the lower base to electrically connect the upper chip to a lower chip. By the heat sink arranged in the internal receiving space formed by the uppermost cover and the lower base, heat generated from the upper chip in operating the upper chip can be greatly dissipated. Therefore, the service lifespan and the performance of the upper chip can be improved. |
