Structures and methods for testing printable integrated circuits

摘要

A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.

主权项

1. An integrated circuit test structure, comprising:
a substrate; an anchor area comprising one or more electrical elements to conduct an electrical test signal, wherein the anchor area is physically secured to a surface of the substrate; and at least one printable electronic component comprising an active layer including one or more active elements thereon, the at least one printable electronic component being suspended over the surface of the substrate by electrically conductive breakable tethers that physically secure and electrically connect the at least one printable electronic component to the anchor area to provide the electrical test signal to the one or more active elements, and wherein the electrically conductive breakable tethers comprise an insulating layer and a conductive layer thereon that are configured to be preferentially fractured responsive to pressure applied thereto to release the at least one printable electronic component from the substrate.