Sensor module

摘要

A cost-effective and extremely space-saving module approach is provided for at least two micromechanical sensor elements having the same packaging requirements. The sensor module described here includes at least two micromechanical sensor elements whose sensor function is based on the direct or indirect impact of a measuring medium. The at least two sensor elements are situated in a shared housing having at least one access opening for the measuring medium, and the at least two sensor elements are stacked with one component back side on one component front side, so that the upper sensor element at least partially covers the active area of the lower sensor element, while still ensuring the impact of the measuring medium, which is used for the sensor function, on the active area of the lower sensor element.

主权项

1. A sensor module, comprising:
at least two micromechanical sensors exposed to a measuring medium, each of the at least two sensors having a sensor function based on one of a direct and an indirect impact of the measuring medium on the sensors; and a housing in which the at least two sensors are situated, the housing including at least one access opening for the measuring medium to be exposed to each of the at least two sensors, wherein: the at least two sensors are stacked in which one component back side is on one component front side, so that an upper sensor of the at least two sensors at least partially covers an active area of the lower sensor of the at least two sensors, while still ensuring the impact of the measuring medium for the sensor function on the active area of the lower sensor, and wherein: each of the at least two sensors includes a pressure-sensitive diaphragm structure, one of the at least two sensors functions as a pressure sensor, another one of the at least two sensors functions as a microphone, and at least the diaphragm structure of the sensor functioning as the microphone spans a cavern in a component back side.