发明名称 Optical proximity sensor and manufacturing method thereof
摘要 The present invention is an optical proximity sensor and manufacturing method thereof. The optical proximity sensor has an optical sensing unit, an illuminating unit, multiple transparent gels and a package. The package encapsulates the optical sensing unit and the illuminating unit. The transparent gels are respectively formed on top surfaces of the optical sensing unit and the illuminating unit. The transparent gels respectively have a convex part and a recess formed in the convex part. The package has through holes communicating with the recesses of the transparent gels to form openings. In a step of injecting encapsulant gel, because the transparent gels are still plastic, the protrusions can closely attach to the transparent gels. The encapsulant gel is prevented from forming above the sensing part and the illuminating part.
申请公布号 US9140600(B2) 申请公布日期 2015.09.22
申请号 US201313769634 申请日期 2013.02.18
申请人 TAIWAN IC PACKAGING CORPORATION;uPI semiconductor corp. 发明人 Chang Yi-Hua;Lin Sue-Ping;Chen Chun-Chi;Hung Tsung-Yu
分类号 H01L23/48;G01J1/04;H01L31/12;H01L31/173;H01L21/56;G01S17/02 主分类号 H01L23/48
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. An optical proximity sensor comprising: an optical sensing unit having a top surface and a sensing part; an illuminating unit having a top surface and an illuminating part; two transparent layers respectively formed on the top surfaces of the optical sensing unit and the illuminating unit, wherein each transparent layer has a convex part and a recess formed in the convex part; and a package encapsulating the optical sensing unit and the illuminating unit and having two through holes corresponding to the sensing part and the illuminating part, wherein the through holes respectively communicate with the recesses of the transparent layers.
地址 Kaohsiung TW