Polishing apparatus

摘要

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

主权项

1. A polishing apparatus comprising:
a substrate-holding mechanism configured to hold a substrate and rotate the substrate; a polishing mechanism arranged above the substrate, said polishing mechanism being configured to apply a pressing force to a polishing tape from above a flat portion of a periphery of an upper surface of the substrate to press the polishing tape against the flat portion so as to polish the flat portion of the periphery of the upper surface; a polishing-tape supply mechanism configured to supply the polishing tape to said polishing mechanism; a moving mechanism configured to move said polishing mechanism in a radial direction of the substrate held on said substrate-holding mechanism; and a pressing-force adjustor configured to adjust the pressing force of said polishing mechanism in accordance with a radial position of said polishing mechanism so as to keep the pressing force constant.