Selective clamping of electronics card to coolant-cooled structure

摘要

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

主权项

1. A cooling apparatus comprising:
a thermal transfer structure to couple to an electronics card and facilitate transfer of heat from the electronics card, the thermal transfer structure comprising:
a clamping structure movable between an opened position and a clamped position, the clamping structure comprising a lid spaced from the electronics card when the thermal transfer structure is coupled to the electronics card; and a coolant-cooled structure residing within an electronic system, and associated with a receiving slot of the electronic system within which the electronics card is to be operatively inserted, the coolant-cooled structure extending into the thermal transfer structure and residing between the electronics card and the lid of the clamping structure when the thermal transfer structure is coupled to the electronics card and the electronics card is operatively inserted into the receiving slot of the electronic system, wherein the opened position of the clamping structure facilitates insertion of the electronics card into the electronic system with the coolant-cooled structure disposed between the electronics card and the lid, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure, including the lid, to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.