Reflow soldering apparatus and method

摘要

The apparatus of the present application reduces poor soldering having gas left there at when soldering. in a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber.

主权项

1. A reflow soldering apparatus for soldering electronic components mounted on a board by circulating atmospheric gas heated in a furnace while transferring the board with the electronic components in the furnace, comprising: a transferring line for providing the board is provided with a pressure reducing chamber capable of reducing a pressure of the atmospheric gas, and gas involved in a heated and melted soldering, part on the board is removed in the pressure reducing chamber, wherein a heating chamber has a heater and a blowing means, and the atmospheric gas heated by the heater circulates within the chamber through the blowing means driven by a motor arranged outside the heating chamber, and further wherein the pressure reducing chamber has a heater and a blowing means, and the atmospheric gas heated by the heater circulates within the chamber through the blowing means driven by a motor arranged outside the heating chamber.