Heat-dissipating assemblies and methods of assembling heat-dissipating assemblies

摘要

Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.

主权项

1. A heat-dissipating assembly, comprising:
heat-generating electrical components; mounting tabs, each mounting tab comprising a first surface and an opposing second surface, the first surface of each mounting tab being attached to a respective heat-generating electrical component, the second surface of each mounting tab being at least substantially coplanar with the second surfaces of each other mounting tab; and a heat sink element abutting the second surfaces of the mounting tabs and attached to at least some of the mounting tabs at the second surfaces of the at least some of the mounting tabs.