Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits

摘要

A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequently embedded in an encapsulated semiconductor device package. The ends of the signal conduits are exposed and the signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package. Holders can be provided in a variety of geometries and materials, depending upon the nature of the application. Further, multiple holders with signal conduits can be provided in a single package to provide for more complex interconnect configuration demands in, for example, system-in-a-package applications.

主权项

1. A method for packaging an electronic device assembly, the method comprising:
providing a conduit assembly comprising a holder and one or more signal conduits attached to the holder, wherein
the holder comprises a moldable, non-conductive material, andthe moldable, non-conductive material is one of a substrate core or a ceramic; placing the conduit assembly in a first area of a carrier for the electronic device assembly, wherein the carrier is distinct from the holder; placing a first electronic device in a second area of the carrier for the electronic device assembly; forming an encapsulant over and around sides of the first electronic device and over and around sides of the conduit assembly; and exposing a first end of a signal conduit of the one or more signal conduits and a second end of the signal conduit, wherein
the signal conduit forms a via through the encapsulated electronic device assembly, andthe signal conduit couples an interconnect formed on a first major surface of the encapsulated electronic device assembly with an interconnect formed on a second major surface of the encapsulated electronic device assembly.