Target device, sputtering apparatus and method for manufacturing a target device

摘要

To provide a target device that can easily be reused in which the amount of gas discharge is small. The present invention is a target device including a backing plate and a target plate that is fixed to the backing plate with a metal brazing material, in which a protective film made of a TiN thin film in which a proportion of (111) plane is at a maximum is formed on an exposed portion of the backing plate. The discharge amount of gas is small, and the brazing material that adheres when fixing the target plate can be easily peeled off.

主权项

1. A method for manufacturing a target device, comprising the steps of:
disposing a backing plate in a nitrogen gas environment under a pressure lower than 1 atm; forming a protective film made of titanium nitride on a surface of the backing plate by vaporizing a titanium metal, and bringing the vaporized titanium metal to reach a surface of the backing plate and then, fixing a target plate to the backing plate; arranging an adhesion-preventing panel onto a part of the backing late where the target plate should be fixed so as to constitute an object to be film-formed by the adhesion-preventing panel and the backing plate, forming the protective film on the object to be film-formed by ionizing and vaporizing a titanium metal, and bringing the vaporized titanium metal to reach the backing plate and exposing (111) plane on the surface of the protective film made of titanium nitride: removing a part of protective film which is formed on the adhesion-preventing panel from the object to be film-formed by removing the adhesion-preventing panel from the backing plate and the exposing a surface of the backing plate where the adhesion-preventing panel was arranged; arranging an indium metal brazing material on the exposed surface of the backing plate; fixing the target plate to the backing plate by softening, melting and solidifying the metal brazing material; and then, removing the metal brazing material which is in close contact and solidified with the protective film.