Method and apparatus for adhesive bond curing

摘要

Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.

主权项

1. An apparatus to cure a laminated resin part comprising:
a frame; a support movably coupled to the frame, the support to slide relative to the frame along a first axis from a part loading position to a part curing position, the support having an opening that is contoured to receive a rotor blade, the support to maintain the rotor blade upright relative to the frame; a pair of clamps movable along a second axis non-parallel relative to the first axis between a release position and a clamping position, the clamps to engage opposite surfaces of a pre-selected portion of the part when the clamps are in the clamping position to apply a pressure to the pre-selected portion, the pre-selected portion of the part being less than an entirety of the part; and a heater coupled to the clamps, the heater to heat the pre-selected portion of the part via the clamps to cure the pre-selected portion of the part.