| 摘要 |
<p>The present invention provides a super slim heat radiation chamber using a copper coating deposition structure which coats an inner surface of a chamber with fine copper particles to make the inner surface of the chamber rough, and forms a plurality of support units between an upper plate and a lower plate of the chamber at equal intervals to allow operation fluid stored in the chamber to evaporate, smoothly disperse, and circulate to effectively dissipate generated heat to markedly improve cooling performance of a portable electronic device. The super slim heat radiation chamber using a copper coating deposition structure according to the present invention comprises: a lower plate in a plate shape whose surface is made rough by depositing copper particles on a certain portion (a portion on which a support unit is not formed) of one surface thereof; an upper plate in a plate shape separated from the lower plate by a prescribed gap; support units formed on the lower plate in a prescribed pattern to maintain the prescribed gap between the lower plate and the upper plate; and an adhesive recess formed along a boundary of the lower plate and coated with an adhesive. The lower plate and the upper plate are fixed by the adhesive coated on the adhesive recess. The gap between the lower plate and the upper plate is maintained in a vacuum state and formed in a chamber shape after filling the gap with operation fluid or a refrigerant. A thickness of the deposited copper particles is smaller than a height of the support units. The gap between the lower plate and the upper plate is 70 to 300μm.</p> |
