发明名称 Solid-state image sensor and camera
摘要 A solid-state image sensor, comprising an image sensor chip including a pixel region where a plurality of pixels are arranged and a peripheral region arranged around the pixel region, and a fixing portion including a substrate which supports the image sensor chip and a joint portion which joins the substrate to an external base, wherein the peripheral region includes a first portion, and a second portion which is smaller in an amount of generated heat than the first portion, the substrate includes a first side and a second side, the first portion is arranged nearer the first side than the second side, the second portion is arranged nearer the second side than the first side, and the joint portion is arranged on the first side of the substrate.
申请公布号 US9143665(B2) 申请公布日期 2015.09.22
申请号 US201313860309 申请日期 2013.04.10
申请人 Canon Kabushiki Kaisha 发明人 Hasegawa Shin
分类号 H04N5/225;H01L27/146;H04N5/374;H04N5/335 主分类号 H04N5/225
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A solid-state image sensor comprising: an image sensor chip including a pixel region where a plurality of pixels are arranged, and a peripheral region arranged around the pixel region; and a fixing portion including a substrate which supports the image sensor chip, wherein the image sensor chip and a base are fixed by the fixing portion, wherein the peripheral region includes a first portion, and a second portion which is smaller in an amount of generated heat than the first portion, the substrate includes a first side and a second side, the first portion is arranged nearer the first side than the second side, the second portion is arranged nearer the second side than the first side, and the fixing portion has a joint portion arranged on the first side of the substrate which joins the substrate and the base, and the fixing portion does not have a joint portion arranged on the second side of the substrate which joins the substrate and the base.
地址 Tokyo JP